Copper Sputtering Target Material:

A sputtering target is a material that is used in the sputtering process, which is a form of physical vapor deposition (PVD). In this process, atoms or molecules are ejected from a solid target material and then deposited onto a substrate, forming a thin film. The sputtering is typically caused by bombarding the target with high-energy ions, usually argon ions.

Copper (Cu) sputtering targets are, therefore, made of copper and are used to deposit thin layers of copper onto various substrates.

Applications:

Copper sputtering targets are used in a range of applications:

• Microelectronics: Copper has become the metal of choice for high-performance silicon integrated circuit interconnections due to its excellent electrical conductivity. Copper thin films are used for metallization in semiconductor devices.
• Data Storage: Used in the manufacturing of hard disk drives.
• Solar Energy: Copper can be used in certain types of photovoltaic cells.
• Decorative and Functional Coatings: For providing copper coatings on various substrates.
• Optoelectronics: Especially in the manufacturing of certain types of sensors and devices.

Key Features:

• Conductivity
• Precise Dimension and Shape
• Flatness
• Straightness
• Homogenization
• Grain Size Control