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OC-ETP® - From Right Materials to Right Solutions |
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Copper busbar in electrical applications requires several key electrical and mechanical properties including high electrical conductivity, good formability and surface flatness. These key properties rely heavily upon quality of raw material and consistency of production process.
Through a state-of-the-art production process specifically designed for copper busbar production, OC-ETP ® is cast from the highest purity copper cathode available from mines and smelters
(grade "A" LME registered brand). The Right Material and the Right Production Process
make
OC-ETP ® perfect for all technical and economical solutions to any electrical applications dealing with copper busbar and busduct. In addition,
OC-ETP ® also offers excellent thermal conductivity, hence it suits well with heat exchange applications, where space is limited such as CPU-heatsink. |
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OC-ETP®Chart
Fig1 |
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Right Conductivity |
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Electrical conductivity of any electrical conductor is dependent upon the purity of conductor. OC-ETP® is cast from pure copper cathodes
| with purity of 99.99 %. |
The highest purity raw material enables |
OC-ETP® to offer very high conductivity compared to conventional copper busbar. Electrical conductivity of OC-ETP® is as high as and above 100% IACS (International Annealed Copper Standard), while conventional copper busbar can only offer below 98.0% IACS. |
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Electrical Conductivity
Fig2 |
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Right Formability |
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Formability is a term used to express how good copper busbar can be bent without cracking. Formability is expressed as the minimum bend radius (R) divided by the thickness (t). The smaller the R/t, the better is the formability. The formability of copper busbar is a result of grain size structure of the conductor itself. The OC-ETP® process produces the finest copper grain size structure, offering superior formability to conventional copper busbar.
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Bending
Fig3 |
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Right Flatness |
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Flatness of copper busbar is vital to jointing efficiency. The better flatness also reduces machining works required during preparation of the jointing surface. OC-ETP® has less than 50 µm flatness tolerance which is more than capable of producing superior jointing efficiency. |
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Right Quality |
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With high copper purity 99.99% raw materials, computerized control system and special process to homogenize billets' temperature (soaking chamber), quality of OC-ETP® is extremely stable. Figure 4 illustrates percentage of copper content for standard copper busbar and OC-ETP® copper busbar. |
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Minimum Percentage of Copper Content
Fig4 |
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Right Production Process |
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OC-ETP® is produced from a state-of-the-art production process, specifically designed to produce copper busbar. The process offers the finest copper grain size structure and its surface is free from oxidation and discoloration. Production process of OC-ETP® is very flexible.
It can switch to a new size of busbar within a few minutes enabling
OC-ETP® to offer in small quantities with a variety of sizes. This right combination makes OC-ETP® available in a shorter production time, with faster delivery and hence, better cost management. |
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Right Thermal Conductivity |
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Thermal conductivity is particularly important for electronic and IT applications. OC-ETP® is used in computer application where thermal conductivity is a concern. OC-ETP® has very high thermal conductivity due to high purity of copper content and flatness control. OC-ETP® has successfully supplied quality products to the major heatsink producers for years. |
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Right Property for Welding and Brazing |
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OC-ETP® can be jointed by soldering, brazing and gas shield arc welding without adverse effect. |
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